发明公开
EP2662395A3 Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
审中-公开
环氧树脂，环氧树脂组合物，因此热辐射板与所述化合物
- 专利标题： Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
- 专利标题（中）： 环氧树脂，环氧树脂组合物，因此热辐射板与所述化合物
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申请号： EP13165059.0申请日： 2013-04-24
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公开(公告)号： EP2662395A3公开(公告)日： 2015-03-04
- 发明人: Park, Jae Man , Kim, Hae Yeon , Moon, SungBae , Park, Jeungook , Yun, SungJin , Yoon, JongHeum , Lee, Hyuk Soo , Jeong, Jaehun , Cho, In Hee
- 申请人： LG Innotek Co., Ltd.
- 申请人地址： Seoul Square 541, Namdaemunno 5-ga Jung-gu Seoul 100-714 KR
- 专利权人： LG Innotek Co., Ltd.
- 当前专利权人： LG Innotek Co., Ltd.
- 当前专利权人地址： Seoul Square 541, Namdaemunno 5-ga Jung-gu Seoul 100-714 KR
- 代理机构： DREISS Patentanwälte PartG mbB
- 优先权： KR20120045842 20120430
- 主分类号： C08G59/28
- IPC分类号： C08G59/28 ; C08L63/00 ; C07D303/46 ; H05K1/05
摘要：
An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.
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