Invention Publication
- Patent Title: Heat moisture treated and thermally inhibited starches and flours that improve the crispness of battered and breaded foods
- Patent Title (中): 热湿处理和热抑制淀粉和面粉，以提高糊状物包覆的食品和面包脆
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Application No.: EP13171703.5Application Date: 2013-06-12
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Publication No.: EP2674038A1Publication Date: 2013-12-18
- Inventor: Sistrunk, Callen , Shah, Himanshu , Tarak, Shah
- Applicant: CORN Products Development Inc.
- Applicant Address: 5 Westbrook Corporate Center Westchester, IL 60154 US
- Assignee: CORN Products Development Inc.
- Current Assignee: CORN Products Development Inc.
- Current Assignee Address: 5 Westbrook Corporate Center Westchester, IL 60154 US
- Agency: Held, Stephan
- Priority: US201261659025P 20120613; US201213542162 20120705
- Main IPC: A23L1/00
- IPC: A23L1/00 ; A21D10/04 ; A21D13/00 ; A23L1/217
Abstract:
The application relates to a composition comprising separately by weight from about 20% to about 70% of non-gelatinized starch, from about 5% to about 40% of rice flour, from about 5% to about 30% of high amylose corn starch, and from about 5% to about 40% of heat moisture treated or thermally inhibited flour or starch.
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