发明公开
- 专利标题: A SPRING LOADED LID
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申请号: EP11859926申请日: 2011-02-28
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公开(公告)号: EP2681811A4公开(公告)日: 2017-11-22
- 发明人: TAN CHONG S , HASTINGS ROBERT J , ALLEN JOSEPH R , GILL MICHAEL T , SMITH KELLY K , SAUER KEITH A
- 申请人: HEWLETT PACKARD ENTPR DEV LP
- 专利权人: HEWLETT PACKARD ENTPR DEV LP
- 当前专利权人: HEWLETT PACKARD ENTPR DEV LP
- 优先权: US2011026515 2011-02-28
- 主分类号: H01R33/76
- IPC分类号: H01R33/76 ; H01R13/629
摘要:
A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring.
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