发明公开
EP2722174A1 METHOD FOR PRODUCING POLYIMIDE LAMINATE, AND POLYIMIDE LAMINATE
审中-公开
生产聚酰亚胺层压材料的方法和聚酰亚胺层压材料
- 专利标题： METHOD FOR PRODUCING POLYIMIDE LAMINATE, AND POLYIMIDE LAMINATE
- 专利标题（中）： 生产聚酰亚胺层压材料的方法和聚酰亚胺层压材料
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申请号： EP12801082.4申请日： 2012-06-14
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公开(公告)号： EP2722174A1公开(公告)日： 2014-04-23
- 发明人: NAKAYAMA, Tomonori , NAKAYAMA, Takeshige
- 申请人： Ube Industries, Ltd.
- 申请人地址： 1978-96, Oaza Kogushi Ube-shi, Yamaguchi 755-8633 JP
- 专利权人： Ube Industries, Ltd.
- 当前专利权人： Ube Industries, Ltd.
- 当前专利权人地址： 1978-96, Oaza Kogushi Ube-shi, Yamaguchi 755-8633 JP
- 代理机构： Cabinet Plasseraud
- 优先权： JP2011132739 20110614
- 国际公布： WO2012173202 20121220
- 主分类号： B32B27/34
- IPC分类号： B32B27/34 ; B05D3/02 ; B05D7/24
摘要：
The present invention relates to a method for producing a polyimide laminate, comprising:
forming a thin film of a polyamic acid solution composition on a substrate; and
heating the obtained laminate of the substrate and the thin film of the polyamic acid solution composition at least at a temperature of from more than 150°C to less than 200°C for 10 minutes or more, and then heating the laminate at the highest temperature of from 400°C to 550°C, to form a polyimide layer having a thickness of less than 50 µm on the substrate.
forming a thin film of a polyamic acid solution composition on a substrate; and
heating the obtained laminate of the substrate and the thin film of the polyamic acid solution composition at least at a temperature of from more than 150°C to less than 200°C for 10 minutes or more, and then heating the laminate at the highest temperature of from 400°C to 550°C, to form a polyimide layer having a thickness of less than 50 µm on the substrate.
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