发明公开
EP2723097A2 Microphone module for an electronic device
审中-公开
Mikrofonmodulfürein elektronischesGerät
- 专利标题: Microphone module for an electronic device
- 专利标题(中): Mikrofonmodulfürein elektronischesGerät
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申请号: EP13189645.8申请日: 2013-10-22
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公开(公告)号: EP2723097A2公开(公告)日: 2014-04-23
- 发明人: Lee, Jun-Tae
- 申请人: Samsung Electronics Co., Ltd
- 申请人地址: 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 KR
- 专利权人: Samsung Electronics Co., Ltd
- 当前专利权人: Samsung Electronics Co., Ltd
- 当前专利权人地址: 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 KR
- 代理机构: Nederlandsch Octrooibureau
- 优先权: KR20120117327 20121022
- 主分类号: H04R1/08
- IPC分类号: H04R1/08
摘要:
A microphone module (2) for an electronic device (1) is provided. The microphone module (2) includes a window (10) having at least one microphone hole (111) in a part of an edge of the window (10), a microphone (50) installed in a position corresponding to the microphone hole (111) of the window (10), and a case frame (20) coupled with the window (10) and forming an appearance of the electronic device (1). The microphone module (2) receives an external voice through the microphone hole (111) of the window (10).
公开/授权文献
- EP2723097B1 Microphone module for an electronic device 公开/授权日:2018-08-08
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