发明公开
EP2736125A1 Component module, mating connector, and connection structure between component module and mating connector
审中-公开
Komponentenmodul，Gegenstecker und Verbindungsstruktur zwischen Komponentenmodul und Gegenstecker
- 专利标题： Component module, mating connector, and connection structure between component module and mating connector
- 专利标题（中）： Komponentenmodul，Gegenstecker und Verbindungsstruktur zwischen Komponentenmodul und Gegenstecker
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申请号： EP13250113.1申请日： 2013-11-26
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公开(公告)号： EP2736125A1公开(公告)日： 2014-05-28
- 发明人: Sasaki, Daisuke , Nagata, Takayuki
- 申请人： Hosiden Corporation
- 申请人地址： 4-33, Kitakyuhoji 1-chome Yao-shi, Osaka 581-0071 JP
- 专利权人： Hosiden Corporation
- 当前专利权人： Hosiden Corporation
- 当前专利权人地址： 4-33, Kitakyuhoji 1-chome Yao-shi, Osaka 581-0071 JP
- 代理机构： Beresford, Keith Denis Lewis
- 优先权： JP2012259028 20121127
- 主分类号： H01R13/516
- IPC分类号： H01R13/516 ; H01R13/66
摘要：
A component module is disclosed that can be manufactured with a reduced number of components and reduced man-hours for assembling. The component module M includes a case 100, a circuit board 200, an electronic component 300, and a connector 400. The case 100 has a through-hole 111. The circuit board 200 is provided in the case 100. The electronic component 300 and the connector 400 are mounted on the circuit board 200. The connector 400 includes a connecting portion 411 and terminals 420, a portion of which is located at the connecting portion 411. The connecting portion 411 is opposed to the through-hole 111 of the case 100.
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