发明公开
- 专利标题: Array substrate and manufacturing method thereof
- 专利标题(中): 阵列基板及其制造方法
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申请号: EP13196858.8申请日: 2013-12-12
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公开(公告)号: EP2744011A1公开(公告)日: 2014-06-18
- 发明人: Song, Youngsuk , Yoo, Seongyeol , Choi, Seungjin , Kim, Heecheol
- 申请人: Boe Technology Group Co. Ltd.
- 申请人地址: No. 10 Jiuxianqiao Rd. Chaoyang District Beijing 100015 CN
- 专利权人: Boe Technology Group Co. Ltd.
- 当前专利权人: Boe Technology Group Co. Ltd.
- 当前专利权人地址: No. 10 Jiuxianqiao Rd. Chaoyang District Beijing 100015 CN
- 代理机构: Brötz, Helmut
- 优先权: CN201210537767 20121212
- 主分类号: H01L51/52
- IPC分类号: H01L51/52 ; H01L27/32
摘要:
Embodiments of the present invention disclose a method for manufacturing an array substrate comprising: forming patterns of a thin film transistor structure and a passivation layer (7) on a base substrate (1) to define a plurality of pixel units on the base substrate; forming subsequently patterns of a transflective layer (8) and a color filter (9) in a pixel region (a) of the pixel unit, the color filter being disposed above the transflective layer; forming an organic light-emitting diode (11, 13, 14) in the pixel region of the pixel unit so that the transflective layer (8) and the color filter (9) are disposed between the organic light-emitting diode and the thin film transistor structure. Embodiments of the present invention also provide an array substrate.
公开/授权文献
- EP2744011B1 Method for manufacturing an array substrate 公开/授权日:2023-05-03
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