发明公开
- 专利标题： METHOD AND APPARATUS FOR ESTIMATING THE TEMPERATURE OF A SEMICONDUCTOR CHIP
- 专利标题（中）： 方法和一种用于确定半导体芯片的温度
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申请号： EP12750735.8申请日： 2012-08-13
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公开(公告)号： EP2753903A1公开(公告)日： 2014-07-16
- 发明人: THØGERSEN, Paul Bach , RANNESTAD, Bjørn
- 申请人： KK-Electronic A/S
- 申请人地址： Bøgildvej 3 7430 Ikast DK
- 专利权人： KK-Electronic A/S
- 当前专利权人： KK-Electronic A/S
- 当前专利权人地址： Bøgildvej 3 7430 Ikast DK
- 代理机构： Olesen, Kaj
- 优先权： EP11180313 20110907; US201161534660P 20110914
- 国际公布： WO2013034400 20130314
- 主分类号： G01K7/01
- IPC分类号： G01K7/01 ; G01K15/00 ; F03D11/00 ; H01L23/473
摘要：
The invention regards a method for estimating the temperature of a semiconductor chip accommodated in a power semiconductor device in operation, such as an IGBT power module, the method comprising the steps of; while the power semiconductor device is in operation determining a voltage drop over the power semiconductor device for at least a first value of applied current and; estimating the temperature of the semiconductor chip by evaluating the relationship between the determined voltage drop and the first value of applied current on the basis of a semiconductor chip temperature model.
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