发明公开
EP2767362A2 Laser processing apparatus and laser processing method
有权
LASERVERARBEITUNGSGERÄTUND LASERVERARBEITUNGSVERFAHREN
- 专利标题: Laser processing apparatus and laser processing method
- 专利标题(中): LASERVERARBEITUNGSGERÄTUND LASERVERARBEITUNGSVERFAHREN
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申请号: EP14152038.7申请日: 2014-01-22
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公开(公告)号: EP2767362A2公开(公告)日: 2014-08-20
- 发明人: Amano, Kanehide , Matsuda, Morikatsu , Ohara, Toshihide , Kobayashi, Eiki
- 申请人: AMADA COMPANY LIMITED
- 申请人地址: 200 Ishida Isehara-shi Kanagawa 259-1196 JP
- 专利权人: AMADA COMPANY LIMITED
- 当前专利权人: AMADA COMPANY LIMITED
- 当前专利权人地址: 200 Ishida Isehara-shi Kanagawa 259-1196 JP
- 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser
- 优先权: JP2013009228 20130122
- 主分类号: B23K26/08
- IPC分类号: B23K26/08 ; B23K26/38
摘要:
A laser processing apparatus includes a table that places a work thereon, a processing head that emits a laser beam toward the work, a head unit that supports the processing head, a first mover that moves the head unit along the table along a first axis, a second mover that moves the head unit along the table along a second axis, a rotor supported in the head unit and turnable around a third axis orthogonal to the first and second axes, and a linear mover supported inside the rotor and linearly movable in both directions along a diameter of the rotor for a predetermined movable distance shorter than the diameter of the rotor, the linear mover supporting the processing head so that the laser beam from the processing head advances along a fourth axis parallel to the third axis.
公开/授权文献
- EP2767362B1 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD 公开/授权日:2016-10-12
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