发明公开
EP2777909A2 Case, method of manufacturing case, and electronic device 审中-公开
Gehäuse,Verfahren zur Herstellung desGehäusesund elektronische Vorrichtung

Case, method of manufacturing case, and electronic device
摘要:
Disclosed is a case including an injection preform (210, 310, 410) having a recess (111a) on at least one portion of a surface thereof, a deposition layer (120) deposited on a surface of the injection preform, and a paint layer (130) formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a suface of the injection preform, and forming a paint layer on the deposition layer.
公开/授权文献
信息查询
0/0