发明公开
EP2777909A2 Case, method of manufacturing case, and electronic device
审中-公开
Gehäuse,Verfahren zur Herstellung desGehäusesund elektronische Vorrichtung
- 专利标题: Case, method of manufacturing case, and electronic device
- 专利标题(中): Gehäuse,Verfahren zur Herstellung desGehäusesund elektronische Vorrichtung
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申请号: EP14157800.5申请日: 2014-03-05
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公开(公告)号: EP2777909A2公开(公告)日: 2014-09-17
- 发明人: Hwang, Chang-Youn , Kim, Won-Tae , Kim, Hak-Ju , Choi, Jong-Chul
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 KR
- 代理机构: Gover, Richard Paul
- 优先权: KR20130026950 20130313
- 主分类号: B29C45/00
- IPC分类号: B29C45/00 ; G06F1/16
摘要:
Disclosed is a case including an injection preform (210, 310, 410) having a recess (111a) on at least one portion of a surface thereof, a deposition layer (120) deposited on a surface of the injection preform, and a paint layer (130) formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a suface of the injection preform, and forming a paint layer on the deposition layer.
公开/授权文献
- EP2777909A3 Case, method of manufacturing case, and electronic device 公开/授权日:2015-07-29
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