发明公开
EP2836998A1 DISPOSITIF MAGNETIQUE A ECRITURE ASSISTEE THERMIQUEMENT
审中-公开
MAGNETVORRICHTUNG MTWÄRMEUNTERSTÜTZTEMSCHREIBVERFAHREN
- 专利标题: DISPOSITIF MAGNETIQUE A ECRITURE ASSISTEE THERMIQUEMENT
- 专利标题(英): Magnetic device with thermally-assisted writing
- 专利标题(中): MAGNETVORRICHTUNG MTWÄRMEUNTERSTÜTZTEMSCHREIBVERFAHREN
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申请号: EP13720462.4申请日: 2013-04-09
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公开(公告)号: EP2836998A1公开(公告)日: 2015-02-18
- 发明人: DIENY, Bernard
- 申请人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 申请人地址: Bâtiment le Ponant D 25 rue Leblanc 75015 Paris FR
- 专利权人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人地址: Bâtiment le Ponant D 25 rue Leblanc 75015 Paris FR
- 代理机构: Lebkiri, Alexandre
- 优先权: FR1253251 20120410
- 国际公布: WO2013153321 20131017
- 主分类号: G11C11/16
- IPC分类号: G11C11/16 ; G11C11/15 ; G11C11/56
摘要:
The invention relates to a magnetic device (1) with thermally assisted writing, comprising at least one magnetic element including: a reference layer (2) having a stable vortex magnetisation configuration; means for creating a magnetic field for reversibly moving the core of the vortex in the plane of the reference layer; a storage layer (4) having a variable magnetisation configuration; a non-magnetic spacer (3) which separates the reference layer (2) and the storage layer (4) and magnetically decouples same; an antiferromagnetic trapping layer (5) in contact with the storage layer (4), which can trap the magnetisation configuration of the storage layer, said storage layer having at least two storage levels corresponding to two trapped magnetisation configurations; and heating means for heating the antiferromagnetic trapping layer (5) such that, during heating, the temperature of the antiferromagnetic trapping layer exceeds its blocking temperature such that, when hot, the magnetisation configuration of the storage layer (4) is no longer trapped.
公开/授权文献
- EP2836998B1 DISPOSITIF MAGNETIQUE A ECRITURE ASSISTEE THERMIQUEMENT 公开/授权日:2020-05-06
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