发明公开
EP2841869A1 VERFAHREN ZUR BEREITSTELLUNG EINES KÜHLMEDIUMS IN EINEM SEKUNDÄRKREIS
审中-公开
EEREMSEKUNDÄRKREIS的VERFAHREN ZUR BEREITSTELLUNG EINESKÜHLMEDIUMS
- 专利标题： VERFAHREN ZUR BEREITSTELLUNG EINES KÜHLMEDIUMS IN EINEM SEKUNDÄRKREIS
- 专利标题（英）： Method for providing a cooling medium in a secondary circuit
- 专利标题（中）： EEREMSEKUNDÄRKREIS的VERFAHREN ZUR BEREITSTELLUNG EINESKÜHLMEDIUMS
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申请号： EP13720299.0申请日： 2013-04-23
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公开(公告)号： EP2841869A1公开(公告)日： 2015-03-04
- 发明人: KOMPA, Raymund , FÖRSTER, Markus , WALTER, Andreas
- 申请人： BASF SE
- 申请人地址： 67056 Ludwigshafen DE
- 专利权人： BASF SE
- 当前专利权人： BASF SE
- 当前专利权人地址： 67056 Ludwigshafen DE
- 优先权： EP12165458 20120425
- 国际公布： WO2013160293 20131031
- 主分类号： F28F27/00
- IPC分类号： F28F27/00 ; F28B9/06 ; F28D15/00
摘要：
Method for providing a cooling medium with regulated feed temperature in a secondary circuit (20), wherein, in the secondary circuit (20), the cooling medium absorbs heat from one or more process coolers (22) and subsequently releases heat to primary water in a primary circuit (10) before flowing back to the process coolers (22), characterized in that at least two primary heat exchangers (12, 14) are provided for cooling the cooling medium, furthermore a bypass line (26) in the secondary circuit (20) branches off downstream of the outlet from the process coolers (22) in order to bypass the primary heat exchangers (12, 14), and the regulation of the temperature in the secondary circuit (20) in the feed line to the process coolers (22) is realized through adjustment of the bypass flow.
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