发明授权
- 专利标题: CELL MODULE ASSEMBLY
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申请号: EP14190153.8申请日: 2014-10-23
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公开(公告)号: EP2866296B1公开(公告)日: 2018-09-12
- 发明人: Hwang, Jaecheol , Cho, Yongseon , Kim, Seokmin
- 申请人: LG ELECTRONICS INC.
- 申请人地址: 128 Yeoui-daero Yeongdeungpo-Gu Seoul 150-721 KR
- 专利权人: LG ELECTRONICS INC.
- 当前专利权人: LG ELECTRONICS INC.
- 当前专利权人地址: 128 Yeoui-daero Yeongdeungpo-Gu Seoul 150-721 KR
- 代理机构: Vossius & Partner Patentanwälte Rechtsanwälte mbB
- 优先权: KR20130127369 20131024
- 主分类号: H01M2/10
- IPC分类号: H01M2/10 ; H01M10/613 ; H01M10/6551 ; H01M10/6555 ; H01M10/647
摘要:
A cell module assembly is provided. The cell module assembly may include a plurality of cells for generating electrical energy, at least one heat plate interposed between the plurality of cells, to absorb heat from the plurality of cells, the at least one heat plate having a cooling chamber at both ends thereof, and at least one cartridge to accommodate the plurality of cells and the at least one heat plate, the cooling channel being internally defined in the cartridge.
公开/授权文献
- EP2866296A1 Cell module assembly 公开/授权日:2015-04-29
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