- 专利标题： MICROCHIP AND METHOD FOR PRODUCING MICROCHIP
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申请号： EP13817319.0申请日： 2013-05-09
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公开(公告)号： EP2871482B1公开(公告)日： 2018-07-18
- 发明人: WATANABE, Hidetoshi , SEGAWA, Yuji , KATO, Yoshiaki
- 申请人： Sony Corporation
- 申请人地址： 1-7-1 Konan Minato-ku Tokyo 108-0075 JP
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： 1-7-1 Konan Minato-ku Tokyo 108-0075 JP
- 代理机构： D Young & Co LLP
- 优先权： JP2012153584 20120709
- 国际公布： WO2014010299 20140116
- 主分类号： G01N35/08
- IPC分类号： G01N35/08 ; B01J19/00 ; G01N37/00
摘要：
There is provided a microchip including a plurality of substrate layers, and bonding layers provided at boundary surfaces between the substrate layers and configured to include a silicon compound. At least one of the bonding layers is configured to include an organic silicon compound.
公开/授权文献
- EP2871482A1 MICROCHIP AND METHOD FOR PRODUCING MICROCHIP 公开/授权日：2015-05-13
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