发明授权
- 专利标题： Additives for electroplating baths
- 专利标题（中）： 电镀浴添加剂
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申请号： EP14196708.3申请日： 2014-12-08
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公开(公告)号： EP2881389B1公开(公告)日： 2018-01-31
- 发明人: Kozhukh, Julia , Niazimbetova, Zuhra I. , Rzeznik, Maria Anna
- 申请人： Rohm and Haas Electronic Materials LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Houghton, Mark Phillip
- 优先权： US201314098555 20131206
- 主分类号： C07D239/48
- IPC分类号： C07D239/48 ; C07D403/12 ; C07D403/14 ; C25D3/10
摘要：
Reaction products of halogenated pyrimidines and nucleophilic linker units are included in metal electroplating baths to provide good throwing power. The electroplating baths can be used to plate metal, such as copper, tin and alloys thereof on printed circuit boards and semiconductors and fill through-holes and vias.
公开/授权文献
- EP2881389A1 Additives for electroplating baths 公开/授权日：2015-06-10
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