发明公开
EP2919263A1 COVER MATERIAL FOR HERMITIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT
审中-公开
COVER材料用于包装电子元件密封和包装
- 专利标题： COVER MATERIAL FOR HERMITIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT
- 专利标题（中）： COVER材料用于包装电子元件密封和包装
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申请号： EP13852845.0申请日： 2013-11-08
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公开(公告)号： EP2919263A1公开(公告)日： 2015-09-16
- 发明人: YOKOTA, Masayuki , YAMAMOTO, Masaharu
- 申请人： Neomax Materials Co., Ltd. , Hitachi Metals, Ltd.
- 申请人地址： 2-19-1, Minami-Suita Suita-shi Osaka 564-0043 JP
- 专利权人： Neomax Materials Co., Ltd.,Hitachi Metals, Ltd.
- 当前专利权人： Neomax Materials Co., Ltd.,Hitachi Metals, Ltd.
- 当前专利权人地址： 2-19-1, Minami-Suita Suita-shi Osaka 564-0043 JP
- 代理机构： Hoffmann Eitle
- 优先权： JP2012248261 20121112
- 国际公布： WO2014073665 20140515
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/06 ; H03H9/02 ; H03H9/10
摘要：
This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material 1 for hermetic sealing is constituted of a clad material including a base material layer made of an Ni-Cr-Fe alloy containing Ni, Cr and Fe or an Ni-Cr-Co-Fe alloy containing Ni, Cr, Co and Fe, and a surface layer bonded to one surface of the base material layer on a side of an electronic component containing member and made of Ni or an Ni alloy.
公开/授权文献
- EP2919263B1 COVER MATERIAL FOR HERMETIC SEALING OF A PACKAGE 公开/授权日：2021-08-18
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