The disclosure relates to a method of forming a digital embossing (17) on a surface (2) by bonding hard press particles (67) to a carrier (68). A liquid binder pattern (P) is applied on the carrier by a digital drop application head. Hard press particles (67) are applied on the carrier (68) and the binder pattern such that some hard press particles are bonded to the carrier (68) by the liquid pattern and non-bonded press particles (67) are removed. The carrier (68) with the bonded hard press particles (67) is pressed to the surface (2) and an embossing is formed when the carrier (68) with the hard press particles (67) is removed.