发明公开
EP2944665A1 POLYAMIDE RESIN AND USE THEREOF AND POLYAMIDE COMPOSITION CONSISTING OF SAME
审中-公开
POLYAMIDHARZ UND VERWENDUNG DAVON SOWIE POLYAMIDZUSAMMENSETZUNG DARAUS
- 专利标题: POLYAMIDE RESIN AND USE THEREOF AND POLYAMIDE COMPOSITION CONSISTING OF SAME
- 专利标题(中): POLYAMIDHARZ UND VERWENDUNG DAVON SOWIE POLYAMIDZUSAMMENSETZUNG DARAUS
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申请号: EP14738201.4申请日: 2014-01-10
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公开(公告)号: EP2944665A1公开(公告)日: 2015-11-18
- 发明人: ZHANG, Chuanhui , CAI, Tongmin , ZENG, Xiangbin , CAO, Min , XIA, Shiyong , YE, Nanbiao , CHEN, Dahua , YUAN, Shaoyan
- 申请人: Kingfa Sci&Tech Co. Ltd. , Zhuhai Wango Chemical Co. Ltd.
- 申请人地址: No. 33 Kefeng Road Science City Guangzhou Hi-tech Industrial Developement Zone Guangzhou, Guangdong 510520 CN
- 专利权人: Kingfa Sci&Tech Co. Ltd.,Zhuhai Wango Chemical Co. Ltd.
- 当前专利权人: Kingfa Sci&Tech Co. Ltd.,Zhuhai Wango Chemical Co. Ltd.
- 当前专利权人地址: No. 33 Kefeng Road Science City Guangzhou Hi-tech Industrial Developement Zone Guangzhou, Guangdong 510520 CN
- 代理机构: Von Kreisler Selting Werner - Partnerschaft von Patentanwälten und Rechtsanwälten mbB
- 优先权: CN201310013794 20130114
- 国际公布: WO2014108091 20140717
- 主分类号: C08G69/36
- IPC分类号: C08G69/36 ; C08L77/00
摘要:
The present invention discloses a polyamide resin and its application and polyamide composition thereof. The repeating units of the described polyamide resin comprises the following components: dicarboxylic acid units composed 80-100mol% of polyamide resin; aliphatic diamines units having 2-14 carbon atoms composed 80-100mol% of polyamide resin; lactam or amino acid units having 6-14 carbon atoms composed 0-20mol% of polyamide resin; in the described polyamide resin, the bio-based carbon concentration is more than 45%; the described bio-based carbon mole concentration is calculated according to the formula below: bio-based carbon concentration=(bio-based carbon mole content/total organic carbon mole content)*100%. The described polyamide resin in the present invention has low gas volatile, hence the polyamide composition produced thereof has low gas volatile too, and can be applied to food-contact field. In addition, the surface condition after reflow soldering of the polyamide composition produced is good.
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