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发明公开
EP2950328A4 SUCTION APPARATUS, CARRY-IN METHOD, CONVEYANCE SYSTEM, LIGHT EXPOSURE DEVICE, AND DEVICE PRODUCTION METHOD 审中-公开
SAUGVORRICHTUNG，EINTRAGEVERFAHREN，FÖRDERSYSTEM，LICHTEXPOSITIONSVORRICHTUNG UND VORRICHTUNGSHERSTELLUNGSVERFAHREN

SUCTION APPARATUS, CARRY-IN METHOD, CONVEYANCE SYSTEM, LIGHT EXPOSURE DEVICE, AND DEVICE PRODUCTION METHOD
摘要：
In a carrier system, a chuck unit (153) is used to hold a placed wafer (W) from above, and vertical-motion pins (140) use suction to hold the wafer (W) from below. Then, chuck unit (153) and vertical-motion pins (140) are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table (WTB). During the lowering, the holding force exerted by chuck unit (153) and the arrangement of chuck members (124) are optimally adjusted such that, as a result of the restraint of wafer (W) by chuck unit (153) and vertical-motion pins (140), localized surplus-restraint is imparted to wafer (W), and warping does not occur.
摘要（中）：

在载体系统中，卡盘单元（153）用于从上方保持放置的晶片（W），并且垂直运动销（140）使用吸力从下面保持晶片（W）。 然后，随后将卡盘单元（153）和垂直运动销（140）降低直到晶片的底表面与晶片台（WTB）接触。 在下降期间，卡盘单元（153）施加的保持力和卡盘构件（124）的布置被最佳地调节，使得由于通过卡盘单元（153）限制晶片（W）和垂直运动 销（140），局部剩余约束被赋予晶片（W），并且不发生翘曲。

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