发明公开
EP2959509A1 MULTI-CHIP MODULE WITH A COMPRESSIBLE STRUCTURE FOR MAINTAINING ALIGNMENT BETWEEN CHIPS IN THE MODULE
有权
MEHRCHIPMODUL MIT KOMPRIMIERBARER STRUKTUR ZUR AUFRECHTERHALTUNG DER AUSRICHTUNG ZWISCHEN CHIPS DEM MODUL
- 专利标题： MULTI-CHIP MODULE WITH A COMPRESSIBLE STRUCTURE FOR MAINTAINING ALIGNMENT BETWEEN CHIPS IN THE MODULE
- 专利标题（中）： MEHRCHIPMODUL MIT KOMPRIMIERBARER STRUKTUR ZUR AUFRECHTERHALTUNG DER AUSRICHTUNG ZWISCHEN CHIPS DEM MODUL
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申请号： EP13707504.0申请日： 2013-02-14
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公开(公告)号： EP2959509A1公开(公告)日： 2015-12-30
- 发明人: MENKHAUS, Todd , FONG, Hao
- 申请人： NANOPAREIL, LLC , Menkhaus, Todd , Fong, Hao
- 申请人地址： 310 N. Derby Lane No. 96 Dakota Dunes, South Dakota 57049 US
- 专利权人： NANOPAREIL, LLC,Menkhaus, Todd,Fong, Hao
- 当前专利权人： NANOPAREIL, LLC,Menkhaus, Todd,Fong, Hao
- 当前专利权人地址： 310 N. Derby Lane No. 96 Dakota Dunes, South Dakota 57049 US
- 代理机构： Tostmann, Holger Carl
- 国际公布： WO2014126575 20140821
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/48
摘要：
An MCM includes a two-dimensional array of facing chips, including island chips (120-1, 120-2) and bridge chips (122) that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures (124) are in cavities (114) in a substrate (110), which house the bridge chips, and provide a compressive force on the back surface of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.
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