发明公开
EP2988935A1 TIE-LAYER ADHESIVES FOR STYRENIC MULTI-LAYER STRUCTURES
审中-公开
BINDESCHICHTKLEBSTOFFEFÜRSTYROLHALTIGE MEHRSCHICHTIGE STRUKTUREN
- 专利标题: TIE-LAYER ADHESIVES FOR STYRENIC MULTI-LAYER STRUCTURES
- 专利标题(中): BINDESCHICHTKLEBSTOFFEFÜRSTYROLHALTIGE MEHRSCHICHTIGE STRUKTUREN
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申请号: EP14788158.5申请日: 2014-04-24
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公开(公告)号: EP2988935A1公开(公告)日: 2016-03-02
- 发明人: BOTROS, Maged, G.
- 申请人: Equistar Chemicals LP
- 申请人地址: 1221 Mckinney Suite 700 Lyondellbasell Tower Houston, TX 77010 US
- 专利权人: Equistar Chemicals LP
- 当前专利权人: Equistar Chemicals LP
- 当前专利权人地址: 1221 Mckinney Suite 700 Lyondellbasell Tower Houston, TX 77010 US
- 代理机构: Sacco, Marco
- 优先权: US201361815811P 20130425
- 国际公布: WO2014176433 20141030
- 主分类号: B32B27/32
- IPC分类号: B32B27/32 ; B32B27/06
摘要:
A multilayer structure and a method for forming a multilayer structure, the multilayer structure includes: (A) a first polyolefin layer; (B) a styrene polymer layer; (C) a second polyolefin layer; and (D) at least one tie-layer comprising a tie-layer composition. The tie-layer composition includes: (1) 25 to 75 wt. %, based upon the total weight of the tie-layer composition, of a first copolymer, wherein the first copolymer comprises ethylene derived units and units derived from a C4-8 α-olefin; (2) 5 to 25 wt. %, based upon the total weight of the tie-layer composition, of a polyethylene resin grafted with an ethylenically unsaturated carboxylic acid or acid derivative; (3) 20 to 50 wt. %, based upon the total weight of the tie-layer composition, of a triblock copolymer composition; and (4) optionally, 0.001 to 20 wt. %, based upon the total weight of the tie-layer composition, of a low density polyethylene.
公开/授权文献
- EP2988935B1 TIE-LAYER ADHESIVES FOR STYRENIC MULTI-LAYER STRUCTURES 公开/授权日:2020-02-26
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