Invention Publication
- Patent Title: WATER-SOLUBLE CUTTING/GRINDING FLUID
- Patent Title (中): 水溶性切削/磨削液
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Application No.: EP14804769.9Application Date: 2014-05-28
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Publication No.: EP3006544A1Publication Date: 2016-04-13
- Inventor: KITAI, Masashi , HIGASHI, Kohei , HIRANO, Hidekazu , ISA, Hajime , NISHIRA, Masanori , SHIOTANI, Hitoshi , IWAMOTO, Keiji , MIGAKI, Youhei
- Applicant: NTN Corporation
- Applicant Address: 3-17, Kyomachibori 1-chome Nishi-ku Osaka-shi, Osaka 550-0003 JP
- Assignee: NTN Corporation
- Current Assignee: NTN Corporation
- Current Assignee Address: 3-17, Kyomachibori 1-chome Nishi-ku Osaka-shi, Osaka 550-0003 JP
- Agency: Vossius & Partner Patentanwälte Rechtsanwälte mbB
- Priority: JP2013115858 20130531
- International Announcement: WO2014192789 20141204
- Main IPC: C10M169/04
- IPC: C10M169/04 ; C10M105/14 ; C10M105/18 ; C10M129/16 ; C10M133/08 ; C10M135/06 ; C10M145/36 ; C10M173/02 ; C10N10/02 ; C10N30/00 ; C10N40/22
Abstract:
The present invention addresses the problem of providing a water-soluble cutting or grinding fluid that has excellent permeability and washability, that can be widely used in cutting or grinding, and that is particularly suitable for use in superfinishing. The present invention provides a water-soluble cutting or grinding fluid that contains a glycol compound (A), at least one substance (B) selected from the group consisting of organic amines and inorganic alkalis, a surfactant (C), and water (D), the water-soluble cutting or grinding fluid having a contact angle of 2 to 15° as measured using the θ/2 method one second after a drop of a dilution of the water-soluble cutting or grinding fluid is dropped on an SPCC-SB plate.
Public/Granted literature
- EP3006544B1 WATER-SOLUBLE CUTTING/GRINDING FLUID Public/Granted day:2021-05-05
Information query
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