发明公开
- 专利标题: HEAT EXCHANGER
- 专利标题(中): 热交换器
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申请号: EP14735800.6申请日: 2014-06-11
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公开(公告)号: EP3008417A1公开(公告)日: 2016-04-20
- 发明人: OLIVA, John C. , WERNER, Brad , ZALAR, Michael
- 申请人: Hemlock Semiconductor Corporation
- 申请人地址: 12334 Geddes Road Hemlock, MI 48626 US
- 专利权人: Hemlock Semiconductor Corporation
- 当前专利权人: Hemlock Semiconductor Corporation
- 当前专利权人地址: 12334 Geddes Road Hemlock, MI 48626 US
- 代理机构: Thomson, Craig Richard
- 优先权: US201361833812P 20130611
- 国际公布: WO2014201116 20141218
- 主分类号: F28F7/02
- IPC分类号: F28F7/02 ; F28F9/02 ; F28F13/08
摘要:
A heat exchanger transfers heat between first and second material streams. The heat exchanger includes a body portion including vent channels configured to pass the first material stream through the body portion. The body portion further includes feed channels configured to pass the second material stream through the body portion. The feed channels are spaced from and in thermal communication with the vent channels such that at least one of the first and second material streams transfer heat with another one of the first and second material streams. Each of the feed channels has an inlet having a crosssectional area with the cross-sectional area of the inlet of at least one of the feed channels different than the cross-sectional area of the inlet of another one of the feed channels for normalizing a flow rate of the second material stream through the feed channels.
公开/授权文献
- EP3008417B1 HEAT EXCHANGER 公开/授权日:2019-07-31
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