发明公开
- 专利标题: PACKAGE
- 专利标题(中): 包
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申请号: EP14819879.9申请日: 2014-06-27
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公开(公告)号: EP3018069A1公开(公告)日: 2016-05-11
- 发明人: YOKOYAMA, Hiroki , KITAMASU, Masayuki
- 申请人: Suntory Beverage & Food Limited , Suntory Holdings Limited
- 申请人地址: 1-1 Kyobashi 3-chome Chuo-ku Tokyo 104-0031 JP
- 专利权人: Suntory Beverage & Food Limited,Suntory Holdings Limited
- 当前专利权人: Suntory Beverage & Food Limited,Suntory Holdings Limited
- 当前专利权人地址: 1-1 Kyobashi 3-chome Chuo-ku Tokyo 104-0031 JP
- 代理机构: Vossius & Partner Patentanwälte Rechtsanwälte mbB
- 优先权: JP2013138245 20130701
- 国际公布: WO2015002108 20150108
- 主分类号: B65D65/26
- IPC分类号: B65D65/26 ; B65D65/32 ; B65D75/62
摘要:
An improvement is made in a package including a protective film enclosing an article and a tack label coupled to an outer surface of the protective film such that a step of forming a slit in the protective film can be omitted and the need to form a dent at a specific area in the article is eliminated. A protective film (5) includes an overlapping portion (5L) in which a first edge portion (5A) directly opposing the article (2) and a second edge portion (5B) opposing the article (2) via the first edge portion (5A) are overlapped with each other, and in a coupling surface between a tack label (10) coupled so as to cover the overlapping portion (5L) and a protective film (5), a non-uniform coupling force distribution is provided in which a second region (RB, 11B) continuously connected to the second edge portion (5B) has a higher coupling force than a first region (RA, 11A) continuously connected to the first edge portion (5A).
公开/授权文献
- EP3018069B1 PACKAGE 公开/授权日:2019-07-31
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