Invention Grant
- Patent Title: FOOD COMPOSITION WITH A LAYER COMPRISING FUNGUS
- Patent Title (中): 与蘑菇一层食物组成
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Application No.: EP14744598.5Application Date: 2014-07-30
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Publication No.: EP3062626B1Publication Date: 2017-02-22
- Inventor: CHAPMAN, John William , DANTUMA, Anouk , HEIJNE, Katrina Gesina , VAN DE POLL, Jonkheer Theodoor Hendrik , POPP, Alois Konrad
- Applicant: Unilever N.V. , Unilever PLC
- Applicant Address: Weena 455 3013 AL Rotterdam NL
- Assignee: Unilever N.V.,Unilever PLC
- Current Assignee: Unilever N.V.,Unilever PLC
- Current Assignee Address: Weena 455 3013 AL Rotterdam NL
- Agency: Fijnvandraat, Arnoldus
- Priority: EP13180874 20130819
- International Announcement: WO2015024751 20150226
- Main IPC: A23D7/06
- IPC: A23D7/06 ; A23C13/00 ; A23L3/36 ; A23L27/60 ; A23C13/16 ; A23L3/3571 ; A23P20/10 ; A23L29/20 ; A23L31/00 ; A23L23/00 ; A23P20/20
Abstract:
A food composition, wherein the surface of the food composition is at least partly covered by a layer, wherein the layer comprises fungus and a water-soluble biopolymer.
Public/Granted literature
- EP3062626A1 FOOD COMPOSITION WITH A LAYER COMPRISING FUNGUS Public/Granted day:2016-09-07
Information query
