发明公开
EP3063829A1 METHOD AND ARRANGEMENT FOR BOARD-TO-BOARD INTERCONNECTION
审中-公开
VERFAHREN UND ANORDNUNG ZUR VERBINDUNG VON LEITERPLATTEN
- 专利标题： METHOD AND ARRANGEMENT FOR BOARD-TO-BOARD INTERCONNECTION
- 专利标题（中）： VERFAHREN UND ANORDNUNG ZUR VERBINDUNG VON LEITERPLATTEN
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申请号： EP13896519.9申请日： 2013-11-01
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公开(公告)号： EP3063829A1公开(公告)日： 2016-09-07
- 发明人: ZHOU, Bo , CHEN, Junyou , LIU, Kun
- 申请人： Telefonaktiebolaget LM Ericsson (publ)
- 申请人地址： 164 83 Stockholm SE
- 专利权人： Telefonaktiebolaget LM Ericsson (publ)
- 当前专利权人： Telefonaktiebolaget LM Ericsson (publ)
- 当前专利权人地址： 164 83 Stockholm SE
- 代理机构： Ericsson
- 国际公布： WO2015062067 20150507
- 主分类号： H01Q1/38
- IPC分类号： H01Q1/38
摘要：
A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.
公开/授权文献
- EP3063829B1 METHOD AND ARRANGEMENT FOR BOARD-TO-BOARD INTERCONNECTION 公开/授权日：2019-06-26
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