A method for modifying thermal performance of an electronic apparatus deployed in a subterranean region, the method including separating the region from surrounding subterranean material using a separation element, burying the apparatus in the region using doped material, the doped material comprising a first material having a first thermal conductivity doped with a second material having a second thermal conductivity, wherein a thermal conductivity of the second material is higher than the thermal conductivity of the first material to increase thermal performance of the first material.