An injection molding apparatus comprising: a manifold, a nozzle, A distal tip of the nozzle being comprised of a highly heat conductive insert and an insulation cap that is substantially less heat conductive than the insert, the downstream end portion of the insulation cap being disposed between the gate and the downstream end portion of the highly heat conductive insert forming a fluid seal around the gate, a valve pin, wherein when the valve pin is in a gate closed position, an axially interior surface of a fluid exit aperture of the insulation cap surrounds a gap enabling circumferential surface of the valve pin forming a spatial gap immediately upstream of the gate between the interior surface of the fluid exit aperture of the insulation cap and the gap enabling circumferential surface of the valve pin.