发明公开
- 专利标题: HOT-MELT ADHESIVE
- 专利标题(中): 热熔胶粘剂
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申请号: EP15769713.7申请日: 2015-03-20
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公开(公告)号: EP3124566A1公开(公告)日: 2017-02-01
- 发明人: FUJINAMI, Hiroki , KOBAYASHI, Kenji
- 申请人: Idemitsu Kosan Co., Ltd
- 申请人地址: 1-1 Marunouchi 3-chome Chiyoda-ku Tokyo 100-8321 JP
- 专利权人: Idemitsu Kosan Co., Ltd
- 当前专利权人: Idemitsu Kosan Co., Ltd
- 当前专利权人地址: 1-1 Marunouchi 3-chome Chiyoda-ku Tokyo 100-8321 JP
- 代理机构: Gille Hrabal
- 优先权: JP2014062687 20140325
- 国际公布: WO2015146845 20151001
- 主分类号: C09J123/10
- IPC分类号: C09J123/10 ; C09J11/06 ; C09J123/00 ; C09J123/16
摘要:
Provided are a hot-melt adhesive having high flowability in a molten state and exhibiting high adhesion strength in bonding PP nonwoven fabrics and further exhibiting high adhesion strength in bonding PE film-PP nonwoven fabric, and a base polymer for a hot-melt adhesive. The hot-melt adhesive contains (A) a propylene-based polymer satisfying the following (Ai) to (Aiv), and (B) an olefin-based copolymer satisfying the following (Bi) and (Bii); and the base polymer for a hot-melt adhesive consists of a mixture of (A) a propylene-based polymer satisfying the following (Ai) to (Aiv) and (B) an olefin-based copolymer satisfying the following (Bi) and (Bii) and satisfies the following (1) and (2). (Ai) the melting point is 120°C or lower, (Aii) the Mw is 10,000 to 150,000, (Aiii) the Mw/Mn is 2.5 or less, (Aiv) the penetration is 8 or less, (Bi) the penetration is 15 or more, (Bii) the melting point is 90°C or higher, (1) the tensile elastic modulus at 23°C is 400 MPa or less, and (2) the semi-crystallization time at 23°C is 20 minutes or less.
公开/授权文献
- EP3124566B1 HOT-MELT ADHESIVE 公开/授权日:2021-04-28
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