发明授权
- 专利标题: MULTICHANNEL LINK AGGREGATION WITH TDLS
- 专利标题(中): 多信道链路聚合与TDLS
-
申请号: EP15721061.8申请日: 2015-04-01
-
公开(公告)号: EP3127282B1公开(公告)日: 2017-08-09
- 发明人: ABRAHAM, Santosh Paul , CHERIAN, George , TIMARIU, Luiza
- 申请人: Qualcomm Incorporated
- 申请人地址: 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 专利权人: Qualcomm Incorporated
- 当前专利权人: Qualcomm Incorporated
- 当前专利权人地址: 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 代理机构: Wegner, Hans
- 优先权: US201414244735 20140403
- 国际公布: WO2015153763 20151008
- 主分类号: H04L12/46
- IPC分类号: H04L12/46
摘要:
A method, an apparatus, and a computer program product for wireless communication are provided. In one aspect, an apparatus includes a processor configured to establish a first link with a second apparatus via a first band, establish a second link with the second apparatus via a second band using a tunneling protocol, and receive data from/provide data to the second apparatus via at least one of the first link or the second link, wherein the data received or provided via the first link includes a first medium access control (MAC) address associated with the first link, and the data received or provided via the second link includes a second MAC address associated with the second link. The processor is further configured to bind the first link to the second link to receive the data from/provide the data to the second apparatus via the first band and the second band.
公开/授权文献
- EP3127282A1 MULTICHANNEL LINK AGGREGATION WITH TDLS 公开/授权日:2017-02-08
信息查询