Provided is a silicon wafer polishing composition having an excellent effect of reducing the haze on the surface of silicon wafers and excellent filterability. The composition for polishing silicon wafers provided here includes a silicon-wafer polishing accelerator, an amido group-containing polymer X, an organic compound Y having no amido group, and water. The amido group-containing polymer X has, on the main chain, a building block A derived from a monomer represented by General Formula (1). The relation between the molecular weight M x of the amido group-containing polymer X and the molecular weight M y of the organic compound Y satisfies the expression: 200 ≤ M y x .