{Problem} To provide an electrical contact material, in which diffusion of the material of the conductive substrate into the outermost layer is suppressed even in a high-temperature use environment, and in which the increase in contact resistance is suppressed.
{Means} An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed with respect to the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 µm/µm 2 or less; a method of producing the same; and a terminal.