An abrasive film capable of preventing an undercut of an optical fiber after polishing, while providing a great grinding force is provided. An abrasive film includes a substrate and an abrasive layer overlaid on a top face side thereof, the abrasive layer including a resin binder and abrasive particles dispersed in the resin binder; the content of abrasive particles having a primary particle size of no less than 70 nm being no less than 10% by mass and no greater than 50% by mass with respect to the total abrasive particles; the content of the abrasive particles in the abrasive layer being no less than 84% by mass; and the indentation hardness of the abrasive layer being no greater than 370 N/mm 2 . The abrasive particles are preferably silica particles. An average thickness of the abrasive layer is preferably no less than 4 µm and no greater than 15 µm.