A bonding, communication and control system that, via multiple digital and analog inputs and outputs provided by an on-the-go ready microcontroller, is capable of integrating the function of components required for a device to perform its tasks. Each invention unit has the minimum amount of built in hardware to support its features. First the units can bond, using multiple modes of identification recognition technology. Second, invention units can interconnect and exchange data via encrypted communication. Third, plug and play hardware can be added. Hardware can be customized, but also enables the fourth core feature: the invention can pair to a smart device, making possible full utilization of all of its hardware, software and existing infrastructure, including its ability to send data to and from a remote location. Thereby, both real time monitoring and anticipation of environment, and remote control of parameters of invention-associated devices, are possible.