An improved patch panel assembly includes a frame and faceplate that mate with a housing, and the housing defines a plurality of individual communication ports. The housing is mounted to the patch panel frame and includes jack openings that accommodate data jacks and circuit board openings that accommodate mating blades of circuit boards. The two sets of openings are separated on the housing by an intervening spacing and interposer terminal sets are provided to electrically interconnect the jacks with circuits on the circuit boards. The patch panel housings may be formed in discrete groupings so that, if desired, the patch panels may have ports that are grouped together by bandwidth, storage capability and the like. Inasmuch as the housings are mounted to the patch panel frames, the jacks and the circuit boards can be easily and individually replaced, repaired or upgraded with similar components without requiring disassembly of the patch panel.