发明公开
- 专利标题: SERIAL SIDEBAND SIGNALING LINK
- 专利标题(中): 串行边带信号链接
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申请号: EP14901804.6申请日: 2014-12-24
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公开(公告)号: EP3191969A1公开(公告)日: 2017-07-19
- 发明人: PETHE, Akshay , WAGH, Mahesh , HARRIMAN, David , LIM, Su Wei , DAS SHARMA, Debendra , FROELICH, Daniel , IYER, Venkatraman , JAUSSI, James , WU, Zuoguo
- 申请人: Intel Corporation
- 申请人地址: 2200 Mission College Boulevard Santa Clara, CA 95054 US
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: 2200 Mission College Boulevard Santa Clara, CA 95054 US
- 代理机构: Samson & Partner Patentanwälte mbB
- 优先权: MYPI2014702585 20140911
- 国际公布: WO2016039791 20160317
- 主分类号: G06F13/14
- IPC分类号: G06F13/14
摘要:
Techniques for embedded high speed serial interface methods are described herein. The techniques include an apparatus for sideband signaling including a first serial sideband link module and a second serial sideband link module. The first serial sideband link module is to propagate packets from an upstream port to a downstream port via a first signaling lane, and the second serial sideband link module is to propagate packets from the downstream port to the upstream port via a second signaling lane.
公开/授权文献
- EP3191969B1 SERIAL SIDEBAND SIGNALING LINK 公开/授权日:2020-11-11
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