Systems, media, and methods for modeling electronic products for 3D printing including providing a library of modules and module interfaces; receiving at least one ruleset; receiving preliminary substrate structure data, the preliminary substrate structure data comprising shape and volume data defining a substrate; providing an interface allowing the user to place one or more modules on the substrate; providing an interface allowing the user to place one or more module interfaces, the module interfaces coupling one or more modules together through the substrate; warning the user where placement of a module or module interface violates the at least one ruleset; generating routing of electrically conductive interconnects between placed module interfaces; and generating a finalized substrate structure model by combining the preliminary substrate structure data with module placement data and interconnect routing data.