发明公开
- 专利标题: LIGHT-EMITTING MODULE
- 专利标题(中): 发光模块
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申请号: EP16752260.6申请日: 2016-01-29
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公开(公告)号: EP3211967A1公开(公告)日: 2017-08-30
- 发明人: SAIKI Hidemaro , NISHIKAWA Akira
- 申请人: Kaneka Corporation
- 申请人地址: 3-18, Nakanoshima 2-chome Kita-ku Osaka-shi, Osaka 530-8288 JP
- 专利权人: Kaneka Corporation
- 当前专利权人: Kaneka Corporation
- 当前专利权人地址: 3-18, Nakanoshima 2-chome Kita-ku Osaka-shi, Osaka 530-8288 JP
- 代理机构: Hoffmann Eitle
- 优先权: JP2015032232 20150220; JP2015036097 20150226
- 国际公布: WO2016132871 20160825
- 主分类号: H05B33/06
- IPC分类号: H05B33/06 ; H01L51/50
摘要:
To provide, in a simple and cost-effective manner, a planar light-emitting module with reduced thickness as a whole, with its substrate end ensuring shock resistance and low risk of injury, and being excellent in transferring and dissipating heat.
A light-emitting module 100 of the present invention includes: a bezel 8 having a leg part 84 having an inner height H; a planar light-emitting tile 120; and a printed circuit board 71 having a plurality of heat dissipating through holes 201. A heat dissipating interval 110 is provided between the printed circuit board 71 and the mounted surface. The printed circuit board 71 includes a tile-side main surface being a soaking metal layer including through hole openings.
A light-emitting module 100 of the present invention includes: a bezel 8 having a leg part 84 having an inner height H; a planar light-emitting tile 120; and a printed circuit board 71 having a plurality of heat dissipating through holes 201. A heat dissipating interval 110 is provided between the printed circuit board 71 and the mounted surface. The printed circuit board 71 includes a tile-side main surface being a soaking metal layer including through hole openings.
公开/授权文献
- EP3211967B1 LIGHT-EMITTING MODULE 公开/授权日:2019-01-23
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