- 专利标题: ALL REFLECTIVE WAFER DEFECT INSPECTION AND REVIEW SYSTEMS AND METHODS
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申请号: EP16759622申请日: 2016-03-04
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公开(公告)号: EP3213342A4公开(公告)日: 2018-06-06
- 发明人: ZHANG SHIYU , ZHAO WEI
- 申请人: KLA TENCOR CORP
- 专利权人: KLA TENCOR CORP
- 当前专利权人: KLA TENCOR CORP
- 优先权: US201562127827 2015-03-04; US201562128465 2015-03-04; US201562163979 2015-05-20; US201615055292 2016-02-26
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; G02B13/14 ; G02B17/06
摘要:
Disclosed are methods and apparatus for reflecting, towards a sensor, an Infrared to vacuum ultra-violet (VUV) light that is reflected from a target substrate. The system includes a first mirror arranged to receive and reflect the Infrared to VUV light that is reflected from the target substrate and a second mirror arranged to receive and reflect Infrared to VUV light that is reflected by the first mirror. The first and second mirrors are arranged and shaped so as to reflect Infrared to VUV light from the target substrate towards an optical axis of the apparatus. In another embodiment, the apparatus can also include a third mirror arranged to receive and reflect the Infrared to VUV light that is reflected by the second mirror and a fourth mirror arranged to receive and reflect such illuminating light that is reflected by the third mirror towards the sensor. In one more embodiment, a reflecting or refracting optics is used to relay the image by above optics to the sensor; various magnification is achieved by adjusting the distance between the intermediate image and the relay optics.
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