发明公开
- 专利标题: SEMICONDUCTOR REFRIGERATOR
- 专利标题(中): 半导体冰箱
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申请号: EP15869100.6申请日: 2015-09-28
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公开(公告)号: EP3220081A1公开(公告)日: 2017-09-20
- 发明人: TAO, Haibo , YU, Dong , LI, Peng , LIU, Jianru , WANG, Dingyuan , LI, Chunyang , QI, Feifei , JI, Lisheng
- 申请人: Qingdao Haier Joint Stock Co., Ltd
- 申请人地址: Haier Industry Park Haier Road No. 1 Hi-Tech Zone Laoshan District Qindao, Shandong 266101 CN
- 专利权人: Qingdao Haier Joint Stock Co., Ltd
- 当前专利权人: Qingdao Haier Joint Stock Co., Ltd
- 当前专利权人地址: Haier Industry Park Haier Road No. 1 Hi-Tech Zone Laoshan District Qindao, Shandong 266101 CN
- 代理机构: Ziebig, Marlene
- 优先权: CN201410778449 20141215
- 国际公布: WO2016095589 20160623
- 主分类号: F25D19/00
- IPC分类号: F25D19/00
摘要:
A semiconductor refrigerator comprises a liner (100), at least one semiconductor refrigerating sheet and a plurality of cold-end heat exchanging devices (200). Each cold-end heat exchanging device (200) is configured to allow a refrigerant to flow and perform phase-change heat exchange in the cold-end heat exchanging device (200), so as to transfer cold at a cold end of the at least one semiconductor refrigerating sheet to a storage chamber of the liner (100). Each cold-end heat exchanging device (200) is provided with three refrigerant pipelines (20), each refrigerant pipeline (20) is provided with an evaporating segment (21) with a closed end that is bent and extended downwards in a vertical plane, and evaporating segments (21) of the three refrigerant pipelines (20) of each cold-end heat exchanging device (200) are respectively connected to a rear wall and two side walls of the liner (100) in a thermal manner. Because the plurality of cold-end heat exchanging devices (200) is provided, an effective heat exchange area of a thermal connection to the liner (100) of the refrigerator is enlarged significantly, and therefore energy efficiency of the semiconductor refrigerator is improved significantly.
公开/授权文献
- EP3220081B1 SEMICONDUCTOR REFRIGERATOR 公开/授权日:2019-04-10
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