- 专利标题: JOINED SYNTHETIC RESIN BODY, AND PRODUCTION METHOD THEREFOR
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申请号: EP15885571.8申请日: 2015-11-13
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公开(公告)号: EP3272503A8公开(公告)日: 2018-03-21
- 发明人: UENO, Yuzo , KAWAHARA, Masahiro
- 申请人: Taiho Kogyo Co., Ltd
- 申请人地址: 65 Midorigaoka 3-chome Toyota-shi, Aichi 471-8502 JP
- 专利权人: Taiho Kogyo Co., Ltd
- 当前专利权人: Taiho Kogyo Co., Ltd
- 当前专利权人地址: 65 Midorigaoka 3-chome Toyota-shi, Aichi 471-8502 JP
- 代理机构: Kuhnen & Wacker
- 优先权: JP2015055204 20150318
- 国际公布: WO2016147479 20160922
- 主分类号: B29C65/16
- IPC分类号: B29C65/16 ; B29C65/56
摘要:
There are provided a synthetic resin joined body and a method of manufacturing the same, with which it is possible to secure both of sealing performance of a fluid passage and joint strength between synthetic resin parts, even if an area of a portion to be welded is reduced.
The synthetic resin joined body includes: a baffle plate 110; an oil passage forming member 120 which comes in contact with the baffle plate 110; an oil passage 130 which is formed between the baffle plate 110 and the oil passage forming member 120 and through which lubricant flows; a sealing portion 140 which is formed by welding the baffle plate 110 and the oil passage forming member 120 to each other on an outer side of the oil passage 130 to seal a periphery of the oil passage 130; and a joint portion 150 for joining the baffle plate 110 and the oil passage forming member 120 to each other.
The synthetic resin joined body includes: a baffle plate 110; an oil passage forming member 120 which comes in contact with the baffle plate 110; an oil passage 130 which is formed between the baffle plate 110 and the oil passage forming member 120 and through which lubricant flows; a sealing portion 140 which is formed by welding the baffle plate 110 and the oil passage forming member 120 to each other on an outer side of the oil passage 130 to seal a periphery of the oil passage 130; and a joint portion 150 for joining the baffle plate 110 and the oil passage forming member 120 to each other.
公开/授权文献
- EP3272503A1 JOINED SYNTHETIC RESIN BODY, AND PRODUCTION METHOD THEREFOR 公开/授权日:2018-01-24
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