发明公开
- 专利标题: VERTICAL AND PLANAR TFTS ON COMMON SUBSTRATE
- 专利标题(中): 垂直和平面的共同基底
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申请号: EP16730109.2申请日: 2016-05-27
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公开(公告)号: EP3308397A1公开(公告)日: 2018-04-18
- 发明人: ELLINGER, Carolyn, Rae , MORTON, Christopher, R.
- 申请人: Eastman Kodak Company
- 申请人地址: 343 State Street Rochester, NY 14650-2201 US
- 专利权人: Eastman Kodak Company
- 当前专利权人: Eastman Kodak Company
- 当前专利权人地址: 343 State Street Rochester, NY 14650-2201 US
- 代理机构: Wagner & Geyer
- 优先权: US201514737544 20150612
- 国际公布: WO2016200626 20161215
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L29/786
摘要:
An electronic component includes a first transistor on a substrate. The first transistor includes a first source, a first drain, a first gate dielectric, a first gate, and a first semiconductor channel having a first length. At least a portion of the first semiconductor channel extends in a direction parallel to the substrate. A vertical-support-element on the substrate has a first reentrant profile. A second transistor includes a second source, a second drain, a second gate dielectric, and a second gate having a second semiconductor channel. At least a portion of the second semiconductor channel extends in a direction orthogonal to the substrate in the first reentrant profile of the vertical-support-element.
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