The present invention discloses a semiaromatic copolyamide resin and a polyamide molding composition consisting of the same, consisting of following repeat units:
(A) 26 to 80 mol% of units derived from para-amino benzoic acid;
(B) 4 to 70 mol% of units derived from 11-aminoundecanoic acid or undecanolactam, and 0 to 70 mol% of units derived from other amino acids having 6 to 36 carbon atoms or units consisting of a lactam;
(C) 0 to 37 mol% of units derived from a diamine unit having 4 to 36 carbon atoms; and
(D) 0 to 37 mol% of units derived from a diacid unit having 6 to 36 carbon atoms;
wherein, (A) + (B) + (C) + (D) = 100 mol%; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol% simultaneously.
The semiaromatic copolyamide resin of the present invention has property advantages such as high heat resistance, improved color property, excellent flowability and low water absorption, and the polyamide molding composition consisting of the same also has obvious advantage in the properties such as heat resistance, water absorption and color.