- 专利标题： LIGHT METAL BASED MULTI-LAYER SUBSTRATES
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申请号： EP15903742.3申请日： 2015-09-11
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公开(公告)号： EP3347506A1公开(公告)日： 2018-07-18
- 发明人: CHANG, James , WU, Kuan-Ting (KT) , LIN, Chien-Ting
- 申请人： Hewlett-Packard Development Company, L.P.
- 申请人地址： 11445 Compaq Center Drive W. Houston, Texas 77070 US
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： 11445 Compaq Center Drive W. Houston, Texas 77070 US
- 代理机构： HGF Limited
- 国际公布： WO2017044114 20170316
- 主分类号： C23C28/00
- IPC分类号： C23C28/00 ; C23C8/00 ; C23C8/10 ; C23C22/05 ; C23C26/02
摘要：
Substrates comprising a light metal layer, an oxidized layer formed on the light metal layer, and a polymer hybrid layer formed on the oxidized layer; and methods for forming the substrates are disclosed.
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