- 专利标题: IN-BAND FULL-DUPLEX COMPLEMENTARY ANTENNA
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申请号: EP16852262.1申请日: 2016-08-23
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公开(公告)号: EP3357167A1公开(公告)日: 2018-08-08
- 发明人: SUH, Seong Youp John , YANG, Tae Young , CHOI, Yang-Seok
- 申请人: Intel Corporation
- 申请人地址: 2200 Mission College Boulevard Santa Clara, CA 95054 US
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: 2200 Mission College Boulevard Santa Clara, CA 95054 US
- 代理机构: Lambsdorff & Lange Patentanwälte Partnerschaft mbB
- 优先权: US201514871975 20150930
- 国际公布: WO2017058397 20170406
- 主分类号: H04B1/56
- IPC分类号: H04B1/56 ; H01Q21/24 ; H04B1/02 ; H04B1/06 ; H04B1/54 ; H04B7/005 ; H04B7/26
摘要:
Described herein are technologies related to an in-band full-duplex wireless communication operation. More particularly, the technologies utilize a complementary pair of antennas for signal transmission and reception arranged in a new manner to be both compact (relatively to conventional approaches) and provide an extremely high (e.g., 60 dB or more) isolation.
公开/授权文献
- EP3357167B1 IN-BAND FULL-DUPLEX COMPLEMENTARY ANTENNA 公开/授权日:2020-06-03
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