ADHÉSIF COMPRENANT DES COPOLYMÈRES À BLOCS, POUR L'ENCAPSULATION DE DISPOSITIFS ÉLECTRONIQUES FLEXIBLES, AMÉLIORANT LA PROTECTION CONTRE LA PERMÉABILITÉ AUX GAZ
摘要:
The invention relates to a process for encapsulating a flexible electronic device mounted on a substrate, with at least one sheet that protects against orthogonal gas permeation, by means of an adhesive that protects against lateral gas permeation, the process comprising: a step of applying a precursor of the adhesive that protects against lateral gas permeation, to the surface of the device and/or of the substrate and/or to the surface of the flexible gas-protection sheet, the adhesive precursor comprising at least one pressure-sensitive acrylic block copolymer diluted in a solvent, a step of evaporating the solvent, a step of laminating the adhesive precursor inserted between the substrate and the protective sheet via which the adhesive that protects against lateral gas permeation is obtained.
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