OPTOELEKTRONISCHES BAUELEMENT MIT EINEM LEITERRAHMEN MIT EINER VERSTEIFUNGSSTRUKTUR
摘要:
The invention relates to an optoelectronic component having at least one optoelectronic semiconductor chip, wherein the at least one optoelectronic semiconductor chip is arranged on a top side of a lead frame section (9), wherein the lead frame section (9) has a stiffening structure protruding away from the lead frame section (9) laterally, and wherein the lead frame section (9), the stiffening structure, and the at least one optoelectronic semiconductor chip are embedded in an electrically insulating housing.
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