- 专利标题: FLIP-CHIP SMT LEDs WITH VARIABLE NUMBER OF EMITTING SURFACES
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申请号: EP16767434.0申请日: 2016-09-02
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公开(公告)号: EP3360169A1公开(公告)日: 2018-08-15
- 发明人: DIANA, Frederic S. , FANCSALI, Erno , DE SMET, Thierry , GUTH, Gregory , MARTYNOV, Yourii , SHCHEKIN, Oleg B. , BHARDWAJ, Jyoti
- 申请人: Lumileds Holding B.V. , Fancsali, Erno , Guth, Gregory , Shchekin, Oleg B.
- 申请人地址: The Base, Tower B5 unit 107 Evert van de Beekstraat 1 1118 CL Schiphol NL
- 专利权人: Lumileds Holding B.V.,Fancsali, Erno,Guth, Gregory,Shchekin, Oleg B.
- 当前专利权人: Lumileds Holding B.V.,Fancsali, Erno,Guth, Gregory,Shchekin, Oleg B.
- 当前专利权人地址: The Base, Tower B5 unit 107 Evert van de Beekstraat 1 1118 CL Schiphol NL
- 代理机构: ter Heegde, Paul Gerard Michel
- 优先权: US201562238666P 20151007
- 国际公布: WO2017062119 20170413
- 主分类号: H01L33/60
- IPC分类号: H01L33/60
摘要:
A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an optically reflective layer over the LEDs, and singulating the LEDs into LED units. The method may further include, after forming the optically transparent spacer layer and before singulating the LEDs, forming a secondary light-emitting layer that conforms to the LEDs, cutting the LEDs to form LED groups having a same arrangement, spacing the LED groups on a support, and forming the optically reflective layer in spaces between the LED groups.
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