The invention relates to: a method for bonding two surfaces by means of a reactive adhesive film system comprising at least two adhesive films (F1 and F2), wherein each adhesive film comprises at least one reactive component (R1 and R2), wherein the bonding is effected via a reaction requiring the presence of both reactive components (R1 and R2), wherein a separation layer (T) that is impermeable for the reactive components (R1 and R2) is provided before the bonding between the adhesive films (F1 and F2) to be brought in contact with one another in order to react, and, in order to effect the bonding, the separation layer (T) is removed at least on some sections of the surface by means of a laser, so that the adhesive films (F1 and F2) come into direct contact with one another and the reaction is started in the presence of the two reaction components (R1 and R2); and a reactive adhesive film system for use in said method.