- 专利标题: CMC COMPONENTS HAVING MICROCHANNELS AND METHODS FOR FORMING MICROCHANNELS IN CMC COMPONENTS
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申请号: EP18171028.6申请日: 2018-05-07
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公开(公告)号: EP3401506A2公开(公告)日: 2018-11-14
- 发明人: FREY, David Alan , GALLIER, Kirk Douglas , ROBERTS, Herbert Chidsey
- 申请人: General Electric Company
- 申请人地址: 1 River Road Schenectady, NY 12345 US
- 专利权人: General Electric Company
- 当前专利权人: General Electric Company
- 当前专利权人地址: 1 River Road Schenectady, NY 12345 US
- 代理机构: Katzka, Catherine
- 优先权: US201715592516 20170511
- 主分类号: F01D5/14
- IPC分类号: F01D5/14 ; F01D5/28
摘要:
CMC components (100) having microchannels (116) and methods for forming microchannels (116) in CMC components (100) are provided. For example, a method for forming microchannels (116) in a CMC component (100) comprises laying up a plurality of body plies (120) for forming a body (122) of the CMC component (100)0; laying up a microchannel ply (124) on the plurality of body plies (120) that has at least one void therein for forming at least one microchannel (116); laying up a cover ply (128) on the microchannel ply (124) to define an outer layer (130) of the CMC component (100); and processing the laid up body plies (120), microchannel ply (124), and cover ply (128) to form the CMC component (100). In another embodiment, the method comprises applying an additive matrix (132) to the body plies (120) to define at least one microchannel (116). In still other embodiments, the method comprises machining at least one microchannel (116) in the plurality of body plies (120).
公开/授权文献
- EP3401506B1 METHODS FOR FORMING MICROCHANNELS IN CMC COMPONENTS 公开/授权日:2021-12-01
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